XLDACBL3Intel XLDACBL3 Compatible 40G QSFP+ Passive Copper Cable, 3m (10ft)
The XLDACBL3 cable on this page is the 3m (10ft) version for Intel hosts requiring 40G operation. Its QSFP+ to QSFP+ DAC construction reduces the connection to one factory-terminated assembly. Related lengths, brand cross-references and rack-integration notes support a precise high-density deployment.
OEM Part Number: XLDACBL3HT Part Number: XLDACBL3
Product Highlights
- Compatible alternative to Intel XLDACBL3
- 40G connectivity at 40Gbps
- Interface configuration: QSFP+ to QSFP+
- Fixed length and part number: 3m (10ft), XLDACBL3
- Conductor specification: 30AWG
- Minimum bend radius: 35mm
Specifications
| HT Part Number | XLDACBL3 |
|---|---|
| Intel Compatible | XLDACBL3 |
| Manufacturer | HT |
| Connector Type | QSFP+ to QSFP+ |
| Max Data Rate | 40Gbps |
| Minimum Bend Radius | 35mm |
| Wire AWG | 30AWG |
| Cable Length | 3m (9.84ft) |
| Jacket Material | PVC (OFNR) |
| Temperature | 0 to 70°C (32 to 158°F) |
| Protocols | SFF-8436, QSFP+ MSA and IEEE 802.3ba |
Cable Construction and Routing
This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 35mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.
Length Selection and Installation Planning
At 3m (10ft), this assembly can bridge non-aligned ports or adjacent racks while remaining a single direct-attach link. Support longer horizontal runs with suitable cable management and preserve space for cooling and future maintenance.
Position Within the Length Range
XLDACBL3 occupies the middle of this family between XLDACBL05 at 1.5m (5ft) and XLDACBL5 at 5m (16ft). It adds 1.5m over the shorter option for extra routing clearance, while the next longer version adds another 2m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.
High-Density Rack Integration
In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 35mm; the jacket material is PVC (OFNR).
Network and Protocol Considerations
The intended application is determined by the host interface and protocol support. Listed interface and protocol references include SFF-8436, QSFP+ MSA and IEEE 802.3ba. Confirm that the host firmware and port configuration support the same operating mode.
Passive Copper Operation
A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.
Quality Assurance and Packaging
Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Neutral packaging and customer-specific packing documentation are available on request.
Ordering Information
Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Quantity and any labeling instructions should be attached specifically to XLDACBL3.
Intel Compatibility and Factory Testing
The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. Both connectors are examined before the operating test, which includes link stability and diagnostic indications.
Frequently Asked Questions
Is this an original Intel cable?
No. It is an HT-manufactured compatible alternative for equipment that specifies Intel XLDACBL3.
What details assist a compatibility review?
Provide the equipment manufacturer, model, port type, hardware revision and software release, together with the OEM reference, required length and quantity.
How should an unused assembly be stored?
Protect both connector ends, keep the cable in a loose bend-safe coil and retain its part-number label so the length and compatibility identity remain traceable.
Can different brands be connected with the same assembly?
Only where both hosts explicitly support the complete interface and compatibility arrangement. Document each end and select the appropriate brand-specific product when required.
Shipping and Lead Time
Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. International express, air cargo and sea freight can be selected according to destination and carton volume; customer courier accounts and nominated forwarders are also accepted.
