XLDACBL05Intel XLDACBL05 Compatible 40G QSFP+ Passive Copper Cable, 1.5m (5ft)
The XLDACBL05 cable on this page is the 1.5m (5ft) version for Intel hosts requiring 40G operation. Its QSFP+ to QSFP+ DAC construction reduces the connection to one factory-terminated assembly. Related lengths, brand cross-references and rack-integration notes support a precise high-density deployment.
OEM Part Number: XLDACBL05HT Part Number: XLDACBL05
Product Highlights
- Compatible alternative to Intel XLDACBL05
- 40G connectivity at 40Gbps
- Interface configuration: QSFP+ to QSFP+
- Fixed length and part number: 1.5m (5ft), XLDACBL05
- Conductor specification: 30AWG
- Minimum bend radius: 33.5mm
Specifications
| HT Part Number | XLDACBL05 |
|---|---|
| Intel Compatible | XLDACBL015 |
| Manufacturer | HT |
| Connector Type | QSFP+ to QSFP+ |
| Max Data Rate | 40Gbps |
| Minimum Bend Radius | 33.5mm |
| Wire AWG | 30AWG |
| Cable Length | 1.5m (5ft) |
| Jacket Material | PVC (OFNR) |
| Temperature | 0 to 70°C (32 to 158°F) |
| Protocols | SFF-8436, QSFP+ MSA and IEEE 802.3ba |
Cable Construction and Routing
This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 33.5mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.
Length Selection and Installation Planning
The additional half metre beyond a one-metre assembly gives XLDACBL05 useful routing flexibility when the ports are not directly aligned. It can accommodate a different rack unit or a short service loop, but excess cable should be dressed loosely rather than folded into a tight coil.
Position Within the Length Range
XLDACBL05 occupies the middle of this family between XLDACBL1 at 1m (3ft) and XLDACBL3 at 3m (10ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 1.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.
High-Density Rack Integration
In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 33.5mm; the jacket material is PVC (OFNR).
Network and Protocol Considerations
The intended application is determined by the host interface and protocol support. Listed interface and protocol references include SFF-8436, QSFP+ MSA and IEEE 802.3ba. Confirm that the host firmware and port configuration support the same operating mode.
Passive Copper Operation
A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.
Quality Assurance and Packaging
Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Standard protective packing is used by default, with project documentation arranged when requested.
Ordering Information
Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Keep XLDACBL05 associated with 1.5m (5ft) throughout the order and receiving record.
Intel Compatibility and Factory Testing
The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. Both connectors are examined before the operating test, which includes link stability and diagnostic indications.
Frequently Asked Questions
Is this an original Intel cable?
No. It is an HT-manufactured compatible alternative for equipment that specifies Intel XLDACBL05.
Can excess cable be folded into a compact bundle?
No. Use a supported, bend-safe service loop and observe the listed minimum bend radius. Do not crease the cable or tighten ties around the connector boots.
Will any matching connector operate at the same speed?
Not necessarily. Both hosts must support the stated rate, identification, lane mapping and any required breakout configuration; mechanical compatibility alone is insufficient.
What details assist a compatibility review?
Provide the equipment manufacturer, model, port type, hardware revision and software release, together with the OEM reference, required length and quantity.
Shipping and Lead Time
Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. Worldwide courier services are available, with air or sea freight for consolidated shipments; freight-collect delivery and coordination with a customer’s logistics provider can be arranged.
