H3C XFP-SX-MM850 Compatible 10G XFP SR Transceiver Module

Product Highlights

• Compatible alternative to H3C XFP-SX-MM850
• 10G connectivity at 10Gbps
• Optical wavelength: 850nm
• Specified reach: 300m over OM3 MMF
• LC duplex / MMF interface
• Operating temperature: 0 to 70°C (32 to 158°F)
• Factory compatibility verification and optical performance testing before shipment

Specifications

Applications and Optical Link Design

Typical deployments include switch-to-switch, switch-to-server and aggregation links inside a data hall or between adjacent equipment rooms. The LC duplex interface connects to the specified multimode cabling, and the stated reach depends on fiber grade and link loss. Keep this interface on the matching multimode optical standard rather than connecting it directly to a single-mode wavelength or reach variant.

Before deployment, check the host port type, supported data rate and firmware requirements. The 10G interface configuration must match the remote equipment; sharing a XFP housing alone does not make two transceiver types interoperable.

For this multimode module, confirm fiber grade, modal bandwidth and total loss before commissioning. The 300m over OM3 MMF figure applies only under suitable cabling conditions. Inspect every LC duplex mating point and match the remote optical standard.

Quality Assurance and Packaging

Each XFP-SX-MM850 compatible module is inspected, powered up and functionally checked before protective packing. Dust caps and individual trays shield the interface during transport. Customer references, rack groups and project packing lists can be added for volume orders.

Optical Acceptance, Diagnostics and Handling

For this model, the specified transmit-power range is -3.5~5.3dBm; receiver sensitivity is <-13dBm. A sound acceptance record includes link state, diagnostic temperature, supply voltage and transmit or receive levels where the host exposes them. Compare the readings with the stated ranges rather than treating any received light as proof of adequate margin. Persistent alarms or borderline values should trigger an end-face and complete-channel inspection. Before every insertion, keep dust caps in place until the patch lead is ready, avoid touching the optical end face and use an appropriate inspection and cleaning procedure. Do not look into an active optical interface.

High-Density Port and Thermal Planning

In a densely populated chassis, connector access and airflow form part of the optical-link design. Confirm that neighboring modules and patch leads leave room for latch operation, and include listed power consumption in the host thermal budget. Assess port density together with fiber management. For this model, the principal parameters are data rate 10Gbps, wavelength 850nm, rated reach 300m over OM3 MMF.

Ordering Information

Use XFP-SX-MM850 as the compatibility cross-reference and XFP-10GSR-85 as the HT ordering identity. Keep other reaches or wavelength directions on separate order lines. Neutral labels, customer packaging and project-specific compatibility review are available on request.

H3C Compatibility and Factory Testing

The module is checked for host recognition as XFP-SX-MM850, link establishment and diagnostic reporting. Physical cage fit alone is not treated as evidence of compatibility. Equipment model, hardware revision and software release can be reviewed before dispatch where platform behavior is uncertain.

Frequently Asked Questions

Shipping and Lead Time

Standard configurations normally ship within one to three working days, with production lead times confirmed for larger quantities. International courier, air freight and sea freight are available; customer courier accounts and nominated forwarders are accepted.