Intel XDACBL7M Compatible 10G SFP+ Passive Copper Twinax Cable, 7m (23ft)

Product Highlights

• Compatible alternative to Intel XDACBL7M
• 10G connectivity at 10Gbps
• Interface configuration: SFP+ to SFP+
• Fixed length and part number: 7m (23ft), XDACBL7M
• Cable construction: Passive Twinax
• Conductor specification: 24AWG
• Maximum power consumption: ≤0.1W
• Minimum bend radius: 30mm

Specifications

Power and Thermal Planning

The rated power consumption is ≤0.1W. Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Network and Protocol Considerations

The intended application is 10G Ethernet. Listed interface and protocol references include 1x InfiniBand QDR, DDR, SDR, 10 Gigabit Ethernet, Fibre Channel. Confirm that the host firmware and port configuration support the same operating mode.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

A 7m (23ft) run can remain tidy when its pathway and service allowance are planned together. Keep the complete copper assembly and both connector housings away from tight cable-tie pressure, verify bend control at changes of direction and ensure that neither port supports the assembly’s weight. Record the exact order code after acceptance. The next shorter verified assembly is XDACBL6M at 6m (20ft), which is the better comparison when the managed route leaves substantial unused cable.

Position Within the Length Range

XDACBL7M is the longest of 10 verified length options in this family. Compared with XDACBL6M at 6m (20ft), it provides 1m of additional reach for a longer vertical drop, a wider rack or an adjacent-cabinet route. Confirm that the complete path requires this length, because unused slack still needs supported, bend-safe storage.

High-Density Rack Integration

In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 24AWG; the minimum bend radius is 30mm; the stated power consumption is ≤0.1W; the jacket material is PVC (OFNR).

Cable Construction and Routing

This assembly uses 24AWG conductors, PVC (OFNR) jacket, minimum bend radius 30mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Quality Assurance and Packaging

Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Neutral packaging and customer-specific packing documentation are available on request.

Ordering Information

Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Quantity and any labeling instructions should be attached specifically to XDACBL7M.

Intel Compatibility and Factory Testing

The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. Where supported by the host, link stability and diagnostic indications are reviewed together with the established link.

Frequently Asked Questions

Shipping and Lead Time

Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. International express, air cargo and sea freight can be selected according to destination and carton volume; customer courier accounts and nominated forwarders are also accepted.