X4DACBL3Intel X4DACBL3 Compatible 40G QSFP+ to 4 x 10G SFP+ Passive Copper Breakout Cable, 3m (10ft)
This 3m (10ft) X4DACBL3 compatible assembly provides 40G DAC connectivity for Intel interfaces in a QSFP+ to 4 SFP+ configuration. It is supplied as one complete cable, with specifications and installation guidance that help high-density racks balance reach, connector access and airflow while retaining the exact OEM reference required by the host.
OEM Part Number: X4DACBL3HT Part Number: X4DACBL3
Product Highlights
- Compatible alternative to Intel X4DACBL3
- 40G connectivity at 40Gbps
- Interface configuration: QSFP+ to 4 SFP+
- Fixed length and part number: 3m (10ft), X4DACBL3
- Conductor specification: 30AWG
- Minimum bend radius: 21mm
Specifications
| HT Part Number | X4DACBL3 |
|---|---|
| Intel Compatible | X4DACBL3 |
| Manufacturer | HT |
| Connector Type | QSFP+ to 4 SFP+ |
| Max Data Rate | 40Gbps |
| Minimum Bend Radius | 21mm |
| Wire AWG | 30AWG |
| Cable Length | 3m (9.84ft) |
| Jacket Material | PVC (OFNR) |
| Temperature | 0 to 70°C (32 to 158°F) |
| Protocols | SFF-8436, SFF-8431 and QSFP+ MSA |
Cable Construction and Routing
This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 21mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.
Position Within the Length Range
X4DACBL3 occupies the middle of this family between X4DACBL1 at 1m (3ft) and X4DACBL5 at 5m (16ft). It adds 2m over the shorter option for extra routing clearance, while the next longer version adds another 2m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.
High-Density Rack Integration
In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 21mm; the jacket material is PVC (OFNR).
Network and Protocol Considerations
The intended application is determined by the host interface and protocol support. Listed interface and protocol references include SFF-8436, SFF-8431 and QSFP+ MSA. Confirm that the host firmware and port configuration support the same operating mode.
Breakout Port Mapping
The QSFP+ to 4 SFP+ configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.
Passive Copper Operation
A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.
Length Selection and Installation Planning
At 3m (10ft), this assembly can bridge non-aligned ports or adjacent racks while remaining a single direct-attach link. Support longer horizontal runs with suitable cable management and preserve space for cooling and future maintenance.
Quality Assurance and Packaging
Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Neutral packaging and customer-specific packing documentation are available on request.
Ordering Information
Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Keep X4DACBL3 associated with 3m (10ft) throughout the order and receiving record.
Intel Compatibility and Factory Testing
The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. Both connectors are examined before the operating test, which includes link stability and diagnostic indications.
Frequently Asked Questions
Is this an original Intel cable?
No. It is an HT-manufactured compatible alternative for equipment that specifies Intel X4DACBL3.
Will any matching connector operate at the same speed?
Not necessarily. Both hosts must support the stated rate, identification, lane mapping and any required breakout configuration; mechanical compatibility alone is insufficient.
What details assist a compatibility review?
Provide the equipment manufacturer, model, port type, hardware revision and software release, together with the OEM reference, required length and quantity.
How should an unused assembly be stored?
Protect both connector ends, keep the cable in a loose bend-safe coil and retain its part-number label so the length and compatibility identity remain traceable.
Shipping and Lead Time
Standard configurations normally ship within one to three working days, with production quantities confirmed at order stage. Delivery can be arranged by courier, air freight or sea freight, and goods may instead be handed to an appointed forwarder or shipped on the customer’s courier account.
