QSFP-DD to 8x SFP56-400G-DAC-1M3FT Generic 400G QSFP-DD 8 x 50G PAM4 to 8 x 50G SFP56 50G PAM4 Passive Copper Breakout Cable, 1m (3ft)

Product Highlights

• HT-manufactured DAC assembly in 1m (3ft)
• 400G connectivity at 400Gbps
• Interface configuration: QSFP-DD to 8x SFP56
• Fixed length and part number: 1m (3ft), QSFP-DD to 8x SFP56-400G-DAC-1M3FT
• Cable construction: Passive Breakout DAC
• Conductor specification: 30AWG
• Maximum power consumption: 0.1W (QSFP-DD End)0.1W (SFP56 Per End)
• Minimum bend radius: 33.5mm

Specifications

Signal and Lane Configuration

The listed modulation format is QSFP-DD-8x 50G-PAM4SFP56-50G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Length Selection and Installation Planning

At 1m (3ft), QSFP-DD to 8x SFP56-400G-DAC-1M3FT is a practical choice for direct connections within one rack. Route the cable along the intended management path rather than pulling it diagonally across adjacent connectors, and leave enough clearance for insertion, removal and front-panel airflow.

Position Within the Length Range

QSFP-DD to 8x SFP56-400G-DAC-1M3FT occupies the middle of this family between QSFP-DD to 8x SFP56-400G-DAC-0.5M2FT at 0.5m (2ft) and QSFP-DD to 8x SFP56-400G-DAC-1.5M5FT at 1.5m (5ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 0.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

High-Density Rack Integration

In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 33.5mm; the stated power consumption is 0.1W (QSFP-DD End)0.1W (SFP56 Per End); the jacket material is PVC (OFNR).

Power and Thermal Planning

The rated power consumption is 0.1W (QSFP-DD End)0.1W (SFP56 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 33.5mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is determined by the host interface and protocol support. Listed interface and protocol references include QSFP-DD MSA, SFF-8432, IEEE 802.3bs-400GAUI-8, IEEE802.3cd-50GAUI-1, CMIS 4.0, SFF-8472. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The QSFP-DD to 8x SFP56 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Quality Assurance and Packaging

Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Volume orders can include customer references on the labels and carton list.

Ordering Information

Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Keep QSFP-DD to 8x SFP56-400G-DAC-1M3FT associated with 1m (3ft) throughout the order and receiving record.

Generic Compatibility and Factory Testing

The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Frequently Asked Questions

Shipping and Lead Time

Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. Worldwide courier services are available, with air or sea freight for consolidated shipments; freight-collect delivery and coordination with a customer’s logistics provider can be arranged.