NVIDIA/Mellanox MCP7Y70-H02A Compatible 400G OSFP 8 x 50G PAM4 IHS/Finned Top to 4 x 100G QSFP56 2 x 50G PAM4 InfiniBand HDR Passive Copper Breakout Cable, 2.5m (8ft)

Product Highlights

• Compatible alternative to NVIDIA/Mellanox MCP7Y70-H02A
• 400G connectivity at 400Gbps
• Interface configuration: OSFP (IHS/Finned Top) to 4x QSFP56
• Fixed length and part number: 2.5m (8ft), MCP7Y70-H02A
• Cable construction: Passive Twinax
• Conductor specification: 28AWG
• Maximum power consumption: 0.1W (OSFP End) 0.1W (QSFP56 Per End)
• Minimum bend radius: 30mm

Specifications

Signal and Lane Configuration

The listed modulation format is 8x 50G-PAM4 to Quad 2x 50G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Position Within the Length Range

MCP7Y70-H02A occupies the middle of this family between MCP7Y70-H002 at 2m (7ft) and MCP7Y70-H003 at 3m (10ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 0.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

High-Density Rack Integration

In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 28AWG; the minimum bend radius is 30mm; the stated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End); the jacket material is PVC (OFNR).

Power and Thermal Planning

The rated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 28AWG conductors, PVC (OFNR) jacket, minimum bend radius 30mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is determined by the host interface and protocol support. Listed interface and protocol references include OSFP MSA, IEEE 802.3cd, CMIS v4.0. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The OSFP (IHS/Finned Top) to 4x QSFP56 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

The 2.5m (8ft) version is useful when a two-metre run would leave insufficient working slack. Before installation, check the complete horizontal and vertical path so that MCP7Y70-H02A reaches both ports without tension at either connector.

Quality Assurance and Packaging

Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Neutral packaging and customer-specific packing documentation are available on request.

Ordering Information

Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Keep MCP7Y70-H02A associated with 2.5m (8ft) throughout the order and receiving record.

NVIDIA/Mellanox Compatibility and Factory Testing

The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Frequently Asked Questions

Shipping and Lead Time

Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. Worldwide courier services are available, with air or sea freight for consolidated shipments; freight-collect delivery and coordination with a customer’s logistics provider can be arranged.