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NVIDIA/Mellanox MCP7Y10-N01A Compatible 800G OSFP 8 x 100G PAM4 IHS/Finned Top to 2 x 400G QSFP112 4 x 100G PAM4 InfiniBand NDR Passive Copper Breakout Cable, 1.5m (5ft)

NVIDIA/Mellanox MCP7Y10-N01A Compatible 800G OSFP 8 x 100G PAM4 IHS/Finned Top to 2 x 400G QSFP112 4 x 100G PAM4 InfiniBand NDR Passive Copper Breakout Cable, 1.5m (5ft)

This 1.5m (5ft) MCP7Y10-N01A compatible assembly provides 800G DAC connectivity for NVIDIA/Mellanox interfaces in a OSFP (IHS/Finned Top) to 2x QSFP112 configuration. It is supplied as one complete cable, with specifications and installation guidance that help high-density racks balance reach, connector access and airflow while retaining the exact OEM reference required by the host.

OEM Part Number: MCP7Y10-N01AHT Part Number: MCP7Y10-N01A

Product Highlights

  • Compatible alternative to NVIDIA/Mellanox MCP7Y10-N01A
  • 800G connectivity at 800Gbps
  • Interface configuration: OSFP (IHS/Finned Top) to 2x QSFP112
  • Fixed length and part number: 1.5m (5ft), MCP7Y10-N01A
  • Cable construction: Passive Breakout DAC
  • Conductor specification: 28AWG
  • Maximum power consumption: 0.1W (OSFP End)0.1W (QSFP112 Per End)
  • Minimum bend radius: 40.5mm

Specifications

HT Part NumberMCP7Y10-N01A
NVIDIA/Mellanox InfiniBand CompatibleMCP7Y10-N01A
ManufacturerHT
Form FactorOSFP (IHS/Finned Top) to 2x QSFP112
Max. Data Rate800Gbps
MediaCopper
Cable TypePassive Breakout DAC
Cable Length1.5m (5ft)
Jacket MaterialPVC
Minimum Bend Radius40.5mm
Wire AWG28AWG
Max. Power Consumption0.1W (OSFP End)0.1W (QSFP112 Per End)
Modulation FormatOSFP-8x 100G-PAM4QSFP112-4x 100G-PAM4
Commercial Temperature Range0 to 70°C (32 to 158°F)
Application800G/400G InfiniBand
ProtocolsOSFP MSA, QSFP112 MSA, IEEE 802.3ck, CMIS v5.0

Signal and Lane Configuration

The listed modulation format is OSFP-8x 100G-PAM4QSFP112-4x 100G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Power and Thermal Planning

The rated power consumption is 0.1W (OSFP End)0.1W (QSFP112 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 28AWG conductors, PVC jacket, minimum bend radius 40.5mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is 800G/400G InfiniBand. Listed interface and protocol references include OSFP MSA, QSFP112 MSA, IEEE 802.3ck, CMIS v5.0. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The OSFP (IHS/Finned Top) to 2x QSFP112 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

The additional half metre beyond a one-metre assembly gives MCP7Y10-N01A useful routing flexibility when the ports are not directly aligned. It can accommodate a different rack unit or a short service loop, but excess cable should be dressed loosely rather than folded into a tight coil.

Position Within the Length Range

MCP7Y10-N01A occupies the middle of this family between MCP7Y10-N001 at 1m (3ft) and MCP7Y10-N002 at 2m (7ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 0.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

High-Density Rack Integration

In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 28AWG; the minimum bend radius is 40.5mm; the stated power consumption is 0.1W (OSFP End)0.1W (QSFP112 Per End); the jacket material is PVC.

Quality Assurance and Packaging

Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Volume orders can include customer references on the labels and carton list.

Ordering Information

Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. Keep MCP7Y10-N01A associated with 1.5m (5ft) throughout the order and receiving record.

NVIDIA/Mellanox Compatibility and Factory Testing

The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. Where supported by the host, link stability and diagnostic indications are reviewed together with the established link.

Frequently Asked Questions

Is this an original NVIDIA/Mellanox cable?

No. It is an HT-manufactured compatible alternative for equipment that specifies NVIDIA/Mellanox MCP7Y10-N01A.

Are separate transceivers or patch leads required?

No. This is one complete direct-attach assembly. The ends are not detachable modules and should not be separated from the cable.

Can excess cable be folded into a compact bundle?

No. Use a supported, bend-safe service loop and observe the listed minimum bend radius. Do not crease the cable or tighten ties around the connector boots.

Will any matching connector operate at the same speed?

Not necessarily. Both hosts must support the stated rate, identification, lane mapping and any required breakout configuration; mechanical compatibility alone is insufficient.

Shipping and Lead Time

Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. International express, air cargo and sea freight can be selected according to destination and carton volume; customer courier accounts and nominated forwarders are also accepted.

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Factory in Asia: Shangxue Industrial Area, Shenzhen

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