NVIDIA/Mellanox MCP7H70-V001R30 Compatible 200G QSFP56 4 x 50G PAM4 to 4 x 50G SFP56 50G PAM4 Ethernet Passive Copper Breakout Cable, 1m (3ft)

Product Highlights

• Compatible alternative to NVIDIA/Mellanox MCP7H70-V001R30
• 200G connectivity at 200Gbps
• Interface configuration: QSFP56 to 4x SFP56
• Fixed length and part number: 1m (3ft), MCP7H70-V001R30
• Cable construction: Passive Breakout DAC
• Conductor specification: 30AWG
• Maximum power consumption: 0.1W (QSFP56 End)0.1W (SFP56 Per End)
• Minimum bend radius: 35mm

Specifications

Signal and Lane Configuration

The listed modulation format is QSFP56-4x 50G-PAM4SFP56-50G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Position Within the Length Range

MCP7H70-V001R30 occupies the middle of this family between MCP7H70-V00AR30 at 0.5m (2ft) and MCP7H70-V002R26 at 2m (7ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 1m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

High-Density Rack Integration

In a densely populated rack, connector access and airflow are part of the link design. Choose the shortest length that follows the managed path comfortably, avoid tight bundles around the connector housings and preserve room for latch operation. Where power consumption is listed, include every populated interface in the host thermal budget rather than assessing a single cable in isolation. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 35mm; the stated power consumption is 0.1W (QSFP56 End)0.1W (SFP56 Per End); the jacket material is PVC (OFNR).

Power and Thermal Planning

The rated power consumption is 0.1W (QSFP56 End)0.1W (SFP56 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 35mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is determined by the host interface and protocol support. Listed interface and protocol references include SFF-8661, SFF-8432, IEEE 802.3bs-200GAUI-4, IEEE802.3cd-50GAUI-1, SFP-8636, SFF-8472. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The QSFP56 to 4x SFP56 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

At 1m (3ft), MCP7H70-V001R30 is a practical choice for direct connections within one rack. Route the cable along the intended management path rather than pulling it diagonally across adjacent connectors, and leave enough clearance for insertion, removal and front-panel airflow.

Quality Assurance and Packaging

Each assembly receives a visual connector inspection and functional link check before it is coiled and protected. Packaging is selected to avoid compressing the cable into a tight bundle, and optional rack-based labels help maintain an orderly installation when many identical interfaces are populated together. Standard protective packing is used by default, with project documentation arranged when requested.

Ordering Information

Provide the exact part number, length, quantity and target interface density. For multi-rack projects, list each length separately and identify any preferred carton grouping. Host model and software information can be included for a compatibility review before production or dispatch. This page’s fixed configuration is 1m (3ft); another length must be quoted under its corresponding part number.

NVIDIA/Mellanox Compatibility and Factory Testing

The assembly is evaluated for host recognition and stable link operation, with diagnostics checked where the interface provides them. This approach verifies more than electrical or optical continuity. Exact platform and firmware information remains valuable in high-density deployments because port mode and qualification policy can differ within the same connector family. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Frequently Asked Questions

Shipping and Lead Time

Available stock is normally prepared for dispatch within one to three working days, while larger production requirements are scheduled with the order. Delivery can be arranged by courier, air freight or sea freight, and goods may instead be handed to an appointed forwarder or shipped on the customer’s courier account.